CSAM Inspection: Scanning Acoustic Microscopy Services

C-Mode Scanning Acoustic Microscopy (CSAM, also known as acoustic microscopy, AMI, SAM, and ultrasonic testing (UT)) is an advanced technique utilizing high-frequency ultrasound in pulse/echo and through transmission modes for non-destructive inspection of components. This method is effective in detecting cracks, delamination, discontinuities, and a variety of other anomalies through CSAM imaging.

Integrated components (ICs), microchips, bonded wafers, metals, ceramics, composites, and many other materials can be rapidly inspected for quality assurance, specifically regarding bonding, delamination, voiding, and numerous defects through CSAM testing.

With over 25 years of experience, our engineers perform comprehensive CSAM tests on nearly all types of packages to identify delamination, cracking, die attach/underfill coverage, flip chip bump attach, and package warpage. From individual packages to full JEDEC trays, SAM Labs is equipped to fulfill all of your acoustic microscopy needs.

SAM Labs offers a comprehensive range of frequencies for csam imaging, making it ideal for scanning all types of units. From 5MHz, suitable for thick, attenuative components, to 260MHz for the thinnest flip chips or bonded wafers, SAM Labs ensures effective csam testing and csam test capabilities to meet your needs.

CSAM imaging can be utilized to inspect the internal features of a wide range of electronic components. Through csam testing, components such as BGAs, QFNs, WLCSPs, bumped wafers, bonded wafers, monolithic capacitors, and many others can be examined non-destructively.

As required per the JEDEC standard J-STD-020, pre and post stress CSAM testing, specifically through csam imaging, is an integral part of package moisture sensitivity level testing. SAM Labs has decades of experience in MSL testing and qualification testing in accordance with J-STD-020, including comprehensive csam test methodologies.

Ceramic heaters featuring complex and integrated heater networks can undergo csam testing to inspect for thickness variations, voiding, delamination, and cracking through techniques such as csam imaging.

Composites can be inspected for internal disbonds, cracking, and delamination through csam testing. Additionally, complex geometries can be imaged utilizing surface tracking technologies, including csam imaging techniques.