Scanning Acoustic microscopy

C-Mode Scanning Acoustic Microscopy (CSAM, also referred to acoustic microscopy, AMI, SAM, and ultrasonic testing (UT)) is a technique that utilizes high frequency ultrasound in pulse/echo and through transmission modes to non-destructively inspect components for cracks, delamination, discontinuities, and a wide range of other anomalies.

Integrated components (ICs), microchips, bonded wafers, metals, ceramics, composites, and many other materials and systems can be inspected for quality of bonding/delamination, voiding, and numerous other defects can be imaged rapidly.

With over 25 years of experience, our engineers scan inspect nearly all types of packages for delamination, cracking, die attach/underfill coverage, flip chip bump attach, and package warpage.  From a single package to full JEDEC trays, SAM Labs has the capacity to meet all of your acoustic microscopy needs.

SAM Labs has a full range of frequencies available for scanning all types of units.  From 5MHz for thick, attenuative components to 260MHz for the thinnest of flip chips or bonded wafers, SAM Labs has you covered.

CSAM can be utilized to inspect internal features of a wide range of electronic components.  BGAs, QFNs, WLCSPs, bumped wafers, bonded wafers, monolithic capacitors, and a wide range of other components can be inspected non-destructively.

As required per the JEDEC standard J-STD-020, pre and post stress CSAM is an integral part of package moisture sensitivity level testing.  SAM Labs has decades of MSL testing and qualification testing in accordance with J-STD-020.

Ceramic heaters with complex and integrated heater networks can be inspected for thickness variations, voiding, delamination, and cracking.

Composites can be inspected for internal disbonds, cracking, and delamination.  Complex geometries can be imaged utilizing surface tracking technologies.