Scanning Acoustic Microscopy Services at SAM Labs

Acoustic microscopy services, specifically through non-destructive testing methods like scanning acoustic microscopy (CSAM), are highly effective in identifying delaminations, voiding, and disbonding across a range of materials, including flip chips, composites, plastic encapsulated ICs, and brazes. This advanced non-destructive testing approach is essential for microelectronic failure analysis and significantly enhances PCBA conformance testing, ultimately supporting improved project management consulting across various industries.