714-612-7499 Corona, California
25 Years inside the package
A Corona, California lab built around one question: what’s actually happening inside this part? This facility specializes in microelectronic failure analysis, employing advanced non-destructive testing techniques, including scanning acoustic microscopy, to gain insights into the internal conditions of the components.
For over 25 years, SAM Labs has specialized in microelectronic failure analysis through advanced scanning acoustic microscopy and ultrasonic testing for customers developing reliability-critical electronics. What began as a dedicated C-SAM lab has evolved into a comprehensive non-destructive testing and physical analysis capability, allowing a single lab to effectively carry an investigation to root cause.
With 25 years of experience in microelectronic failure analysis, we guide you in selecting the right sequence of non-destructive testing techniques, interpreting results against the applicable standard, and managing the investigation from start to finish — so you’re not left deciding whether to X-ray before or after using scanning acoustic microscopy.
MIL-STD-883 qualification focuses on flight-hardware reliability and incorporates techniques such as microelectronic failure analysis, non-destructive testing, and scanning acoustic microscopy for effective counterfeit-part detection in hi-rel programs.
Wafer and package qualification, process validation, and vendor qualification support, including microelectronic failure analysis, non-destructive testing, and scanning acoustic microscopy.
Reliability verification for implantable and wearable electronics, where a failure is not an option, often involves microelectronic failure analysis and non-destructive testing techniques like scanning acoustic microscopy.
AEC-Q100 qualification support for suppliers holding zero-defect commitments includes critical processes such as microelectronic failure analysis, non-destructive testing, and scanning acoustic microscopy.
Incoming inspection, vendor audits, and counterfeit screening for high-volume supply chains, including microelectronic failure analysis, non-destructive testing, and scanning acoustic microscopy.
We have served countless industries beyond those listed to identify sources of problems through methods like microelectronic failure analysis, non-destructive testing, and site visits complemented by consulting.
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